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2016樂(lè)泰UF3811膠水最新價(jià)格,ECCOBOND UF3811膠水,正品樂(lè)泰選擇萬(wàn)力固，</p><p>樂(lè)泰UF3811快速固化,3811 UNDERFILL 結(jié)構(gòu)粘接耐高溫</p><p>歡迎各位同行、客戶前來(lái)咨詢</p><p>服務(wù)熱線：1，3，5，1，0，2，4，6，2，9，8</p><p>EMAIL ：DXYOY@qq.com</p><p>Q,Q :38826928</p><p></p><p>PRODUCT DESCRIPTION</p><p>LOCTITE ECCOBOND UF 3811 provides the following product</p><p>characteristics:</p><p>Technology Epoxy</p><p>Appearance Black liquid</p><p>Cure Heat cure</p><p>Product Benefits One component</p><p> Room temperature flow capability</p><p> Halogen free</p><p> Reworkable</p><p> Good thermal cycling reliability</p><p> Stable electrical performance under</p><p>standard Surface Insulation Resistance</p><p>(SIR)</p><p>Application Underfill, Encapsulant</p><p>Typical Package</p><p>Application</p><p>Chip scale packages and BGA</p><p>LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is</p><p>designed for CSP and BGA applications. This low viscosity material is</p><p>formulated to flow at room temperature with no additional preheating</p><p>required. It cures quickly at moderate temperatures to minimize stress</p><p>to other components. When cured, this material has a high glass</p><p>transition temperature while maintaining flexibility in order to protect</p><p>solder joints during thermal cycling and drop testing.